Popular articles What is ceramic frit glass?

What is ceramic frit glass?

What is ceramic frit glass?

Ceramic Fritting is a process by which glass enamel is fused on the glass surface. Before the glass is heat strengthened or tempered, Ceramic frit is applied to the glass through a fine mesh screen with glass enamel. Silk-screening is done by printing a layer of ceramic ink on the glass surface through a screen mesh.

Does spandrel glass need to be tempered?

Spandrel glass must be HEAT TREATED to withstand high thermal stress. If the Spandrel is intended for an opening where safety glass is required by law or code or where human impact is a concern, the glass substrate should be TEMPERED.

Is spandrel glass clear?

Unlike vision glass, which is meant to be transparent, spandrel glass is designed to be opaque in order to help hide features between the floors of a building, including vents, wires, slab ends and mechanical equipment.

Is spandrel a glass?

This is spandrel and it’s a level of glass that is opaque and colored, which also hides the electrical and mechanical areas between the floors of a building. To opacify the glass, one of several products can or have been used; ceramic enamel, silicone elastomers, urethanes, films, etc.

Why is it called spandrel glass?

The origin of the word spandrel comes from the 1400’s as an architecture term to describe the space between two arches, as in the illustration below. It’s spanning the distance between the arches and helping to give structural support.

What is black spandrel glass?

Spandrel glass is the opaque glass that conceals structural building components such as columns, floors, HVAC systems, vents, electrical wiring and plumbing, preventing these from being visible from the exterior of the building.

What does glass frit do?

Glass Frit Bonding During the cooling process, a strong hermetic wafer bond is formed. At the bonding temperature the glass is soft enough to flow and cover surface steps and roughness, such that the glass frit acts as a planarizing and sealing interlayer between the two wafer surfaces to bond.